-- Six Demos Unveil the Company’s Latest Advances in Wi-Fi, Bluetooth® Mesh, Multiprotocol Technology and Cloud Connectivity --
Embedded World 2018
Hall 4A, Booth 4A-128
AUSTIN, Texas – Jan. 18, 2018 – Silicon Labs (NASDAQ: SLAB) Silicon Labs will showcase a variety of low-power wireless connectivity solutions for smart homes, building automation, lighting, metering and other Internet of Things (IoT) applications at Embedded World 2018. Hands-on demonstrations at Silicon Labs’ Booth 4A-128 will highlight the company’s new low-power Wi-Fi portfolio, Bluetooth® mesh and Bluetooth 5 software, 802.15.14 Zigbee/Thread mesh solutions, multiprotocol support for Bluetooth to sub-GHz proprietary networks, secure device-to-cloud connectivity and digital isolation technology to protect embedded systems.
Silicon Labs offers the industry’s most comprehensive wireless connectivity portfolio for the IoT in standalone and multiprotocol configurations. With 15 years of mesh networking experience and more than 100 million deployed nodes, Silicon Labs is at the forefront of bringing multiprotocol wireless solutions to market. Silicon Labs is also a leader in Bluetooth innovation, delivering ultra-small Bluetooth system-in-package (SiP) modules and SoCs that support Bluetooth LE commissioning and Bluetooth mesh connectivity.
Silicon Labs Demos at Booth 4A-128
Silicon Labs’ connectivity, security and embedded experts will deliver the following conference presentations at Embedded World (NCC Ost):
Silicon Labs (NASDAQ: SLAB) is a leading provider of silicon, software and solutions for a smarter, more connected world. Our award-winning technologies are shaping the future of the Internet of Things, Internet infrastructure, industrial automation, consumer and automotive markets. Our world-class engineering team creates products focused on performance, energy savings, connectivity and simplicity. www.silabs.com
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